Breakout board for RAK3172 LoRaWAN module

The RAKwireless RAK3272S Breakout Board gives developers easy access to the board's pins, streamlining development and testing processes. Its footprint follows the XBee form factor, enabling the RAK3172 stamp module pins to be transferred to 2.54 mm headers. The board operates on firmware based on RAKwireless Unified Interface V3 (RUI3), which allows the creation of various functionalities through RUI APIs.

• Based on RAK3172
• I/O ports: UART/I2C/GPIO/SPI
• Serial Wire Debug (SWD) interface
• 64 KB RAM
• RUI3 API Compatible
• AT Commands Support
• Supported bands: (EU433, CN470, RU864, IN865, EU868, AU915, US915, KR920, and AS923)
• Alpha Micro technical support available for maximum benefit for your application